Telit has recently upgraded their Sprint network–compatible Internet of Things (IoT) modules, CE910-DUAL and CL865-DUAL, to add compatibility with band class 10. This enhancement will improve the chip’s in-building penetration over the 800-MHz U.S. Sprint network.
“Devices designed with class 10–capable modules enjoy benefits such as better operation in buildings and urban environments,” said Mike Ueland, president of Telit Americas. “With these upgraded IoT modules and Sprint’s commitment to operating its CDMA network, Sprint and Telit customers have a solid platform to develop, launch and operate new IoT products on Sprint’s proven and reliable CDMA 1xRTT network.”
Some other specs of the CE910-DUAL and CL865-DUAL include:
-
CE910-DUAL
- 2 mm x 28.2 mm x 2.0 mm (1.11” x 1.11” x 0.08”) land grid array package
-
CL865-DUAL
- 4 mm x 24.4 mm x 2.4 mm (0.96” x 0.96” x 0.09”) quad-flat no-leads package
-
Both
- USB 2.0
- Full duplex data rate, 153.6 kbps
- Operating temperature range, –40°C to +85°C (–40°F to 185°F)
Telit assures that these specs make the chips suitable for applications such as the Industrial IoT (IIoT), point of sale, smart metering, telematics and vending.
“Sprint’s commitment to support 1xRTT and EV-DO devices allows our customers to plan for a migration path from CDMA to LTE without being forced into an immediate upgrade or device redesign to accommodate connectivity,” said David Svoren, manager of product portfolio for Sprint’s IoT division. This migration can be made possible with the upgradable nature of the CE910-DUAL (1xRTT only) and DE910-DUAL (1xRTT and EV-DO compatible).
With these chips, engineers will be able to add machine-to-machine communication over the IIoT. The added in-building penetration of these class 10 chips will better ensure that these industrial devices will be able to receive signals over the Sprint network. Because time-sensitive networks are important for IIoT applications such as plant management, process control and automation, you don’t want to have your machines lose connectivity during a production cycle.
What IIoT chip sets do you use? Comment below with your experiences, pros and cons.