ANSYS 17.1 Improves Systems Simulation and AIM Multiphysics

ANSYS has just released version 17.1 of their simulation portfolio. The release focuses on adding more multiphysics functions to ANSYS AIM and expanding the systems simulation capabilities of the portfolio.

ANSYS AIM’s expanding Multiphysics Functionality

Temperature distribution of an insulated-gate bipolar transistor (IGBT) calculated from Ohmic losses determined by a coupled magnetic-thermal simulation. (All image courtesy of ANSYS.)

ANSYS AIM is a CAE software that implements a streamlined user interface (UI) to democratize simulation technologies for design engineers. The purpose is to bring ANSYS’ simulation solver technology into the early design cycle.

Earlier this year, ANSYS AIM added computational fluid dynamics (CFD) abilities to its multiphysics capabilities.

Now the functionality has expanded further to include magnetostatics and coupled magnetic-thermal-structural analysis.

This will further AIM’s ability to simulate designs that incorporate electromechanical functions.

Other improvements to ANSYS AIM include:

  • Polymer extrusion simulation to determine manufacturing and tooling defects
  • Multi-stem custom templates to further democratize simulation technology

Creating System Simulations in the ANSYS Workflow

Washing machine system simulation integrates component models, behavioral models and embedded software designs.

System simulations allow engineers to assess whether the individual part designs will interfere with the overall system. The user can use these assessments to optimize the whole product.

This level of systems analysis and virtual prototyping is becoming more important as designs are becoming increasingly complex and multidisciplinary.

ANSYS 17.1 gives engineers the ability to model physics-based components, behavior models and embed software into the virtual prototype. By linking these models together, the user can create a virtual representation of the whole system to assess real world reactions and potential design flaws early in the development cycle.

Other improvements to the ANSYS portfolio in the 17.1 release include:

  • ANSYS Workbench:
    • Extended models and design flow automation for IoT, antenna and wireless modeling
  • ANSYS Electronics Suite:
    • Improved analysis of signal integrity through complex paths
  • ANSYS Fluids Suite:
    • Improved under-hood simulations
    • Cyclic and polar plots for transient row analysis for turbomachinery simulations
  • ANSYS Mechanical Suite
    • Beam-to-solid and shell-to-solid sub-modeling to convert early design models into 3D
    • Improved motion analysis when models have many contacting sliding parts (chains and gears)
  • ANSYS Semiconductor
    • Improved simulation runtime and memory footprint
    • Thermally aware electromigration analysis

To find out more about ANSYS’ systems engineering portfolio read: Model-Based System Engineering - Beyond Spreadsheets.