Electronics Weekly - Automotive IPs, NEMs Solutions, Bluetooth & More

OmniVision Image Processing for Automotive Applications

(Diagram courtesy OmniVision.)

OmniVision Technologies, Inc. announced the OV491 and OV495, two new companion chips that work in combination with OmniVision's portfolio of automotive RAW image sensors. The OV491 is a compact image signal processor (ISP) companion chip specified to enable surround view system architectures. The OV495 contains the same ISP features but is also equipped with electronic distortion and perspective correction. The OV491 and OV495 are both compatible with OmniVision's OV2775, OV10650, and OV10640 automotive image sensors.

The OV491 supports dual sensor input for streamlined surround view architectures up to two megapixels in resolution. The OV495 can process video streams of up to two megapixels in resolution at a maximum of 60 frames per second, with distortion and perspective correction to enable different viewing modes and angles. The OV495 also supports overlay capabilities for features such as parking guidance to enable rear video mirrors and rear view cameras.

The OV491 and OV495 each come in AEC-Q100 Grade 2-qualified, compact 7 x 7 mm BGA packages. Both chips are currently available for sampling and are expected to enter volume production in the first quarter of 2017. Additional details are available on OmniVision’s website

EXFO NEMs Solutions

LTB-8 Rackmount Platform. (Image courtesy EXFO Inc.)

EXFO Inc. recently announced its latest series of solutions for network equipment manufacturers (NEMs), which include a new power meter, variable attenuators and switches, all compatible with the recently launched LTB-8 Rackmount Platform .

Created for bit error rate (BER) testing and system verification, the FTBx-3500 offers a remote user interface and EXFO Multilink compatibility. It also offers a benchtop unit, which can be controlled remotely or using the touchscreen.

With the FTBx-9150 Optical Switch , FTBx-9160 MEMS Optical Switch and FTBx-9600 Utility Module , EXFO offers a range of optical switches for a wide variety of applications. Providing fiber-to-fiber switching, the FTBx-9150/9160 can be remote controlled via the standard LAN or optical GPIB interface using SCPI commands, IVI drivers and any other automation software.

The FTBx-1750 High-Performance Power Meter delivers measurements for the production floor. The web-based graphical user interface (GUI) allows for configuration of the power meter and status monitoring. Remote control is performed using Telnet over the built-in LAN port or the GPIB to USB adapter.

Visit the EXFO website for more information.

Synopsys Bluetooth Low Energy IP Solution

(Image courtesy of Synopsys Inc.)

Synopsys, Inc. has announced the immediate availability of its DesignWare Bluetooth Low Energy IP solution consisting of the Link Layer and PHY on TSMC's 40-nanometer (nm) ultra-low-power (ULP) processor. The DesignWare Bluetooth Link Layer IP is compliant with the latest Bluetooth specification (v4.2) and incorporates data encryption and random number generators. The Bluetooth PHY will support Bluetooth 5, as well as the IEEE 802.15.4 standard for connectivity over wireless networks.

DesignWare Bluetooth Low Energy Link Layer IP
- Allows up to eight simultaneous connections in a single instantiation
- Distributed functions delivered as RTL and firmware
- Validated interoperability with third-party software stacks via a standard ARM AMBA 3 AHB-Lite interface
DesignWare Bluetooth Low Energy PHY IP
- Optional direct current (DC)-to-DC down-converter optimizes power
- Operation below one-volt
- Integrated on-chip transceiver matching network
- Single pin-to-antenna interface

Synopsys' DesignWare Bluetooth Low Energy Link Layer IP and PHY IP on TSMC 40ULP and 55ULP process technologies are available now.

Synopsys IP Meets Automotive AEC-Q100 Grade 1 Temperature Requirements

(Image courtesy of Synopsys Inc.)

Synopsys, Inc. also announced that its DesignWare Foundation IP, including Logic Libraries and Embedded Memories , meets automotive AEC-Q100 Grade 1 temperature requirements on the TSMC 16-nanometer FinFET Compact (16FFC) and 28-nm High-Performance Compact+ (28HPC+) processes.

This is intended to complement Synopsys' portfolio of automotive-grade IP that offers ASIL B Ready and ASIL D Ready certification, AEC-Q100 testing and TS 16949 quality management. Synopsys also provides virtual prototyping solutions for automotive applications .

Cadence IP for Automotive Applications

(Diagram courtesy of Cadence Design Systems Inc.)

Cadence Design Systems, Inc. recently announced a portfolio of Cadence interface and Denali memory IP solutions for automotive applications, supporting TSMC's 16nm FinFET Compact (16FFC) process.

These newly announced automotive IP solutions are designed to support the most common interfaces used in automotive advanced driver assistance system (ADAS) technology. The interface designs include support for DDR/LPDDR, PCI Express (PCIe), MIPI, automotive Ethernet and USB.

Cadence anticipates initial deliveries of the first high-speed SerDes and low-latency DDR IP for use with TSMC's 16FFC process in the fourth quarter of 2016.

For more information on Cadence's IP offerings, visit the product website .

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