And it’s not just me saying this. The American Society of Mechanical Engineers agrees, and that’s why it’s hosting a series of Engineering Festivals (E-Fests) to engage the next generation of engineers.
E-Fests, which are held regionally, are a series of three-day, two-night events centered around a competition where students can expand what they know, test and showcase their skills, and have a meaningful interaction with innovation.
In a bid to help support the ASME’s efforts, Siemens PLM has become the sponsor of the Innovative Additive Manufacturing 3D Challenge (IAM3D) and will provide all students with Solid Edge software for use in the competition.
“Strong industry collaboration is critical to prepare the next generation of engineers and manufacturers for digitalization,” said Dora Smith, global director, Academic Partner Program, Siemens PLM Software. “Our partnership with ASME E-Fests is just one way we are connecting the manufacturing industry with academia to help train highly qualified future engineers.”
During the IAM3D events, students will use their creativity to add value to an already existing design by applying sound engineering principles and creative designs solutions to a problem. Their designs will then be 3D printed, and the top 3 finishers in each region will advance as semifinalists to the 2017 ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference (IDETC/CIE), being held in Cleveland, Ohio, later this summer.