EW - Production Edition - Bruker Wafer Polishing, EV Group Lithography & More

ASM Standardizes M2M for SMT Production

(Image courtesy of ASM Assembly Systems.)

ASM Assembly Systems has proposed an initiative to develop a communication interface aimed to replace the obsolete SMEMA standard in order to standardized M2M communication in SMT production.

At a meeting in Munich, 16 equipment suppliers to the electronics manufacturing industry agreed on the non-proprietary "Hermes Standard” for vendor-independent machine-to-machine communication in SMT assembly. The TCP/IP and XML-based protocol makes it possible to transport circuit boards with full traceability (i.e., no loss of data) through all stations of an SMT line.

For electronics manufacturers, the open standard promises to deliver more transparency while saving time and money when building and integrating SMT lines. As a result, the Hermes Standard may become a major building block of the smart SMT factory.

For more information, visit ASM Assembly Systems’ website.

Bruker Updates Mechanical Wafer Polishing Processes

(Image courtesy of Bruker.)

Bruker has introduced the TriboLab CMP Process and Material Characterization System, which provides a characterization capability for the development of chemical mechanical polishing (CMP) processes. The TriboLab CMP can provide a range of polishing pressure (0.05-50 psi), speeds (1 to 500 rpm), friction, acoustic emissions and surface temperature measurements for the accurate and complete characterization of CMP processes and consumables.

“CMP is more critical than ever for advanced semiconductor device fabrication,” said Robert Rhoades, CTO of Entrepix. “The industry has been calling for a means to effectively characterize the detailed process and consumables interactions that take place while polishing a wide range of materials. We are pleased to partner with Bruker and assist in the launch of the TriboLab CMP platform.”

Additional details are available on Bruker’s website.

EV Group Lithographic Processing for Semiconductors

(Image courtesy of EV Group.)

EV Group has announced that it is now demonstrating pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications. EVG's products and process development services support this semiconductor back-end fabrication process by protecting bumps and other topography with uniform resist layers and lithographic patterning of narrow dicing streets.

EV Group’s 150 Automated Resist Processing System and IQ AlignerNT Automated Mask Alignment System provide parallel, high-throughput, debris-free die singulation without risking bump reliability or impacting structured surfaces.

The systems address the pre-processing requirements for mid-end-of-line (MEOL) and back-end-of-line (BEOL) processing of MEMS, power devices, RFID components, image sensors, logic and memory.

For more information, visit EV Group’s website.

Manncorp Vapor Phase Soldering System

(Image courtesy of Manncorp.)

Manncorp has launched the 4040 Vapor Phase Soldering System. Designed for today’s sustainable manufacturing facility, the 4040 Vapor can be installed in almost any workspace, without the need for complex ductwork and external venting. The efficient heat transfer and conditions of the vapor phase process generate minimal exhaust which can be managed by a low-cost, self-contained, fume extraction system. The 4040 also has a power rating of less than 3 KW (75-80 percent less than convection ovens).

The illuminated processing chamber, which includes a 14-in viewing window, is completely isolated during soldering and a fluid recovery system collects and filters condensate during cooldown. Cycle times ranging from 6-9 minutes or less and a 18in x 16in work holder allow batch soldering of multiple boards for throughput that supports low to medium-volume production requirements.

Information concerning pricing and availability can be found on Manncorp’s website.

SCREEN Flash Lamp Annealer

(Image courtesy of SCREEN.)

SCREEN has finalized development of its LA-3100 flash lamp annealer. The LA-3100 is designed to provide optimized activation of dopants injected into silicon wafers during the semiconductor manufacturing process.

The LA-3100 controls heating temperature profiles by the millisecond, allowing it to instantly raise the surfaces of silicon wafers to 1,000 or 1,200C. The system also includes a variety of new functions that expand its ability to handle applications requiring annealing processes controlled by the millisecond.

SCREEN has also revamped the design of the transfer system, making it possible to manage oxygen concentrations at an even higher level. This allows the system to be adapted for annealing of titanium-based film, a substrate that is highly sensitive to oxidization.

Detailed technical specifications are available on SCREEN’s website.