EW - Assembly Edition – AMETEK RF Connectors, Kester Soldering Flux & More

AIM Solder Lead-Free Solder Alloy

(Image courtesy of AIM Solder.)

AIM Solder has introduced the REL61 lead-free solder alloy. REL61 addresses some of the challenges with today’s common lead-free alloys, specifically voiding, cost, durability and tin whiskers. Combined with AIM M8 Solder Paste, REL61 has reduced voiding on BTC packages by over 45 percent, increasing both thermal performance and solder joint integrity, according to the company.

The solution aims to offer a low-cost alternative to SAC alloys, with reliability and performance characteristics superior to other low/no-silver solder alloys. AIM testing indicates that REL61 can reduce tin whisker formation as well as outperform SAC alloys in thermal shock, vibration and drop shock resistance.

For more information, visit AIM Solder’s website.

AMETEK Hermetic RF Connector

(Image courtesy of AMETEK.)

AMETEK has introduced the SMPS (Sub-Miniature Press-on-Sub-micro) hermetic miniature RF connector. The SMPS is smaller than the SMPM connector, which makes it suitable for high-density packaging and multiport applications. The SMPS is capable of frequencies up to 65 GHz, exceeding the 40 GHz maximum frequency of the SMPM connector.

“The new SMPS hermetic connector highlights AMETEK ECP’s efforts in design innovation” said Ceasar Morte, head of engineering for AMETEK. “Our manufacturing team can customize body length, pin extensions and terminations, as well as offer solder and weld options for the connector body.”

Additional information about hermetic RF connectors can be found on AMETEK’s website.

Kester Soldering Flux

(Image courtesy of Kester.)

Kester has announced the launch of the SF800-LR soldering flux. SF800-LR is a zero-halogen, low-residue, low-solids, organic-based liquid flux designed specifically for tabbing and stringing applications. The formulation delivers solderability in module assembly processes utilizing conduction, IR and convection reflow. It is formulated to deliver minimum flux residue, thus eliminating post-cleaning after soldering.

Cells are dry and cosmetically clean as they exit the tabber and stringer equipment. SF800-LR provides solderability on various types of metallization. The formulation of SF800-LR is also designed to deliver peel force that results in long term stability of the solder joints.

For more information, visit Kester’s website.

Littlefuse SCR Thyristor

(Image courtesy of Littlefuse.)

Littlefuse has introduced a series of 40A standard high-temperature silicon-controlled rectifier (SCR) thyristors that are ideal for use as switches for rectifier and phase control applications such as voltage regulator, heating and motor speed controls. The SJxx40x Series is the first SCR thyristor from Littelfuse capable of handling 600V, 40Arms and junction temperatures up to 150C.

The SJxx40x Series aims to prevent the overheating and thermal runaway problems SCRs can experience due to an application’s limited cooling capability or occasional overload situation. They are designed to trigger with just a few milliamps of current at less than 1.5V potential.

Key features include:

TO-220AB and TO-263 packages to support flexible mounting options for easier device design
High on-state current (IT) of 40Arms allows the SJxx40X to handle greater load currents
High rate of voltage change over time (dv/dt) to tolerate more line noise and surge often found in commercial AC lines

Detailed schematics can be located on Littlefuse’s website.

Masterbond Electrically Insulative Epoxy

(Image courtesy of Masterbond.)

Masterbond has released the EP39MAOHT, a thermally conductive and electrically insulative epoxy. EP39MAOHT is a room-temperature curing system for bonding, sealing, coating, potting and encapsulation applications.

EP39MAOHT has a low mixed viscosity of 3,000-6,000 cps as well as a one to one mix ratio by weight and a working life of 120-150 minutes for a 100 gram batch. This dimensionally stable system bonds to a wide variety of substrates including metals, ceramics, composites and glass as well as many rubbers and plastics with very low shrinkage upon curing.

This formulation features a thermal conductivity of 9-10 BTUin/ft²•hr•°F [1.30-1.44 W/(m•K)], while retaining electrical insulation properties, including a volume resistivity of >1014 ohm-cm and a dielectric constant of 4.8 at 60 Hz. It offers chemical resistance to water, fuels and hydraulic fluids as well as many acids and bases. In addition, EP39MAOHT is serviceable from -100°F to +400°F.

For more information, visit Masterbond’s website.