Advantest Pick-and-Place IC Handler
The M4872 incorporates a common change kit, which helps to safeguard devices under test from potentially damaging packages. In total, the time it takes to change device types is reduced by more than 45 percent. In addition, the handler’s optional active thermal control unit employs efficient heating/cooling to maintain set point temperatures within 1C over a range of -45C to 125 C.
Advantest’s vision-alignment technology allows devices under test to be precisely positioned, making the handler ideally suited for testing fine-pitch ICs and devices with both top and bottom-side contacts. The resulting improvements in test yields and cycle times contribute to better overall productivity.
For more information, visit Advantest’s website.
EVG Laser Debonding for Fan-out Wafer-Level Packaging
Designed as a module for integration in the company's EVG 850 DB automated debonding system, the laser debonding module incorporates a solid-state laser and beam-shaping optics to enable force-free debonding. Featuring both low-temperature debonding and high-temperature-processing stability, EVG's laser debonding solution is ideal not only for fan-out wafer-level packaging, but also for processing compound semiconductors and power devices.
The module utilizes a solid-state UV laser and an optical setup that shapes the Gaussian beam profile of the laser into a “quasi top hat” beam profile. The setup achieves a reproducible beam with minimal heat introduced to the device wafer and flexible spatial control.
For more information, visit EVG’s website.
Manncorp LED Pick and Place System
The result is minimized head travel between feeders and placement locations, which allows placement rates of 15,000 CPH on panels up to 300 mm maximum width, completely independent of their overall length. Three different models are available for panels of 600, 1200, or 1800 mm maximum length, all of which can be ordered in configurations for inline automation or manual loading and unloading.
Information concerning pricing and availability is located on Manncorp’s website.
SCREEN Compact Wet Station
SCREEN has also upgraded the CW-2000's transfer system, allowing it to clean up to 150 wafers per hour as a standard specification. This volume can be boosted to 300 wafers per hour with the optional half-pitch specification. In addition, facilities can select the number of processing baths used in the CW-2000 according to their specific goals and applications.
Additional technical specifications are available on SCREEN’s website.
Vi Combines 3D Inspection with SIGMA Link for Smart Factories
SIGMA Link is the element for Smart Factories to sort all inspection data and transform them into useful information for users. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yields to increased levels. 5K3D is a 3D AOI based on laser technology with angled cameras attached to the 2D Spectro optical package. The PI Series 3D SPI also provides accurate software for small pads.
For more information, visit Vi Technology’s website.
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