Electronics Weekly - Hitachi FIB-SEM, Microchip In-Circuit Debugger & More

Hitachi Ion Beam-Scanning Electron Microscope

(Image courtesy of Hitachi.)

Hitachi has announced the ETHOS Focused Ion Beam-Scanning Electron Microscope (FIB-SEM). A newly developed magnetic/electrostatic compound lens enables ETHOS to resolve sub-nanometer features in high contrast for low-voltage SEM applications.

The ETHOS incorporates a FIB column used in sample preparation along with the most recent SEM concept for high-magnification observation allowing for the analysis of microscopic surface structure and topography at the micron scale.

The ETHOS system is designed to operate with high-performance devices and nanomaterials, where miniaturization has been advancing, for the preparation of uniformly thin TEM samples for observation and analysis of fine structures at atomic resolution levels, as well as for defect analysis and evaluation.

Additional technical specifications are available on Hitachi’s website.

MediaTek NB-IoT System on Chip

(Image courtesy of MediaTek.)

MediaTek has unveiled the MT2625, a narrow band Internet of Things (NB-IoT) System on Chip (SoC), and announced a collaboration with China Mobile to build the world’s smallest NB-IoT module (16mm x 18mm) around the chipset. The MT2625 SoC supports a full frequency band (from 450MHz to 2.1GHz) of 3GPP R13 (NB1) and R14 (NB2) standards for a range of IoT applications including smart home control, logistics tracking and smart meters.

The MT2625 combines an ARM Cortex-M microcontroller, pseudo-static RAM, flash memory and power management unit into a small package to lower the cost of production while also speeding up time to market. The chip utilizes MediaTek’s low power consumption technology to enable IoT devices to work with chargeable batteries for long periods.

For more information, visit MediaTek’s website.

Microchip In-Circuit Debugger

(Image courtesy of Microchip Technology.)

Microchip Technology Inc. has announced the MPLAB ICD 4, an in-circuit programming and debugging development tool for Microchip’s PIC microcontroller (MCU) and dsPIC digital signal controller systems. The MPLAB ICD 4 debugger includes all the features of the MPLAB ICD 3 tool while adding increased speed through a faster processor and increased RAM.

The MPLAB ICD 4’s improvement in speed is accomplished through a 32-bit MCU running at 300 MHz. The faster processing, along with an increased buffer memory of 2 MB, results in a product that is twice as fast as its predecessor. The puck-shaped device is housed in a black case with a brushed aluminum top and is includes an LED light strip to indicate debugging status.

The MPLAB ICD 4 development tool supports all PIC microcontrollers and dsPIC digital signal controllers in Microchip’s portfolio through the MPLAB X Integrated Development Environment. This simplifies the design process for users when they choose to migrate from one PIC MCU to another to meet the needs of their application.

Information concerning pricing and availability can be found on Microchip’s website.

Pasternack RF and Microwave Power Amplifier Accessories

(Image courtesy of Pasternack,)

Pasternack has released a series of RF and microwave power amplifier accessories that includes heat sinks, heat sinks with cooling fans and power control cable assemblies. Heat sinks are devices that enhance heat dissipation from a hot surface and are ideal for thermal management of power amplifiers in test and measurement applications.

The company has eight different heat sink models, some of which are designated for general purpose usage, and others are configured for select power amplifier models. These heat sinks feature finned extrusion profiles with large baseplate mounting surfaces and AC or DC power supply options for models that support integrated cooling fans. Most models include thermal mounting gaskets for optimal thermal flow.

The general-purpose heat sink models (PE15C5013 and PE15C5013F) can be used for all Pasternack power amplifier models where a heat sink is recommended, typically 1 watt and greater. To support test and measurement applications, the company has four power control cable assemblies that are configured for select power amplifier models with D-sub connector interfaces.

For more information, visit Pasternack’s website.

Silego USB C Integrated Power Splitter/Switch in WLCSP

(Image courtesy of Silego.)

Silego Technology Inc. has announced the SLG59H1302C, a single-input, dual-output power splitter designed for mid and high-end smartphones and tablet PCs. The SLG59H1302C’s 130 V surge protection rating is 30% more effective and its 20 nanosecond reaction time to OVP events is seven times faster than similar models.

The OVP response time protects sensitive downstream components from possible damage. Even though it is designed to operate with 5V, 9V, or 12V power adapters, the SLG59H1302C does not suffer damage even if 20V power adapters are mistakenly used.

Key Features:

28V-tolerant continuous VBUS operation
130V-rated, internal transient voltage suppressor
Input operating voltage range of 2.7V to 13.2V
Push-pull VSYS power digital output
Specified operating temperature range: -40°C to 85°C

Detailed schematics are available on Silego’s website.

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