EW - Assembly Edition - Amphenol Connection System, Dymax Conformal Coating & More

Amphenol Connection System

(Image courtesy of Amphenol.)

Amphenol has introduced a connection system that distributes high current DC power. Designed to connect wire to wire, wire to board, and busbar terminations, the Amphe-PD series distributes higher currents with less heat than similar-sized connectors. The 3.6mm connectors are UL listed at 69A, CSA listed at 55A and support a 50A to 70A continuous duty rating. They meet RoHS and UL-94V-0 guidelines.

The Amphe-PD features RADSOK technology for higher amperage, lower t-rise, less resistance and lower mating forces. The RADSOK terminal provides a stamped hyperbolic contact with multiple beams for optimal current carrying performance. This technology allows for more power in a smaller footprint. The connector series offers a dual position RADSOK in a TUV “touch-proof” safe housing.

For more information, visit Amphenol’s website.

Dymax Low Viscosity Conformal Coating

(Image courtesy of Dymax.)

Dymax has introduced the Multi-Cure 9452-FC, a conformal coating formulated as an alternative to thin, solvent-based conformal coatings. With a viscosity of 20 cP, the material provides a thin coating that is more environmentally friendly than solvent-based alternatives. The multi-cure, light and heat-curable film coating provides electrical insulation properties as well as humidity, thermal shock and corrosion resistance.

Multi-Cure 9452-FC is designed for conformal coating of printed circuit boards and other electronic assemblies. Compatible with most types of spray equipment, 9452-FC fluoresces vivid blue when exposed to UV light (365 nm) for inspection of the coating coverage. It is also suitable for film coating or flow coating application. In addition, its secondary heat-cure feature allows the coating to cure with heat in applications where shadow areas exist.

Information concerning pricing and availability can be found on Dymax’s website.

Kester Solder Paste

(Image courtesy of Kester.)

Kester has released the NP545 solder paste, available with tin-lead T4 powder. NP545 is a zero-halogen, no-clean solder paste formula designed for consistency and repeatability. It is very stable and has an unrefrigerated shelf life of 12 months with no print or solderability degradation. NP545 consistently provides paste transfer efficiencies of 0.55 to 0.5AR. The paste is also capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior. NP545 is classified as ROL0 per IPC J-STD-004B.

Technical and safety data sheets are available on Kester’s website.

Littlefuse Bidirectional TVS Diode Array

(Image courtesy of Littlefuse.)

Littlefuse has introduced 80A discrete bidirectional TVS Diode Arrays as an addition to its SP11xx Series TVS Diode Arrays (SPA Diodes). SP1103C Series 80A Discrete Bidirectional TVS Diodes offer circuit designers standoff voltage options for protecting lower voltage power buses from electrostatic discharge (ESD) damage.

Constructed using TVS diodes fabricated in a silicon avalanche technology, these diodes protect each I/O pin for electronic equipment sensitive to destructive ESDs. These diodes can safely absorb repetitive ESD strikes at ±30kV without performance degradation. Additionally, each diode can safely dissipate 80A of 8/20µs surge current with low clamping voltages.

Additional technical details are located on Littlefuse’s website.

Masterbond Elastomeric Primer/Adhesive System

(Image courtesy of Masterbond.)

Masterbond has launched the X21Med elastomeric primer/adhesive system. Developed for priming and bonding polyolefinic substrates, X21Med is a single component elastomeric compound that passes ISO 10993-5 tests for cytotoxicity.

X21Med is easy to use, either as an adhesive or a primer. It has a low viscosity of less than 250 cps and cures at ambient temperatures or more rapidly with heat. As a primer, it is applied in a thin layer to the surface and the solvent is allowed to evaporate. When used as an adhesive, it should be applied to both substrates and then mated.

The maximum area of bonding effectiveness is about 1 square inch. Once cured, this clear to light amber colored product is tough and not rigid. It has a volume resistivity exceeding 1014 ohm-cm. X21Med is serviceable from -51C to +93C. Since polyolefin plastics are used in almost every industry, X21Med is ideal for use in medical devices, aerospace, electronics and specialty OEM applications, among others.

For more information, visit Masterbond’s website.

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