Dymax Peelable Maskant for PWB Connectors
(Image courtesy of Dymax.)
Dymax has launched Speedmask 9-7001, a light-curable maskant designed for protecting connectors and board-level areas from both solvent-based and light-curable conformal coatings. Cured masks withstand wave solder and reflow temperatures and can be removed in one piece, saving time and eliminating the concern of ionic contamination or residue left behind by other masking methods. The residue-free surface after removal passes SIR testing per IPC-TM-650 and zero keep-out violations.
This halogen and silicon-free maskant is compatible with gold and copper connector pins, cures upon exposure to light and is designed to provide protection of connectors with no discoloration or corrosion. It is thixotropic and is suitable for manual or automated dispensing on boards or components that may be difficult to mask.
For more information, visit Dymax’s website.
EMS Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging
(Image courtesy of Engineered Materials Systems.)
Engineered Materials Systems (EMS) has introduced the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
DF-2005 is capable of fine line and space definition in complex patterns. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. It is less brittle than most negative photo resists, with a glass transition temperature of 145 C and a moderate modulus of 4.5 GPa at 25 C. It is hydrophobic in nature, providing chemical and moisture resistance.
Additional technical specifications can be found on EMS’ website.
Kester Flux-Cored Wire
(Image courtesy of Kester.)
Kester has released the 268 Flux-Cored Wire, a zero-halogen wire optimized for robotic soldering applications. With its chemistry system, 268 provides workability performance for both robotic and manual soldering in the electronics industry, with performance equivalent to conventional halogen/halide-based systems. It provides a clean release, which prevents occurrences of bridges and protrusions, even in narrow-pitch automated drag soldering. The use of 268 results in a clear post-soldering residue without the need for cleaning.
268 is classified as Type ROL0 flux under J-STD-004B specifications. It is zero-halogen and halide-free with no intentional addition of bromine and chlorine, conforming to the requirements of IEC 61249-2-21, JPCA-ES-01 and IPC-410B specifications.
Information concerning pricing and availability is located on Kester’s website.
Littlefuse SCR Thyristor
(Image courtesy of Littlefuse.)
Littlefuse has introduced a series of high-temperature SCR (silicon-controlled rectifier) thyristors, which are circuit protection devices that offer a junction temperature of 150°C in compact surface-mount D-PAK (TO-252) packaging. These devices are also available in through-hole V-PAK (TO-251) packages. Standard SJ Series SCR Thyristors have a low gate current trigger level of 6mA or 15mA maximum at approximately 1.5V. Sensitive models in the series feature a gate trigger current of less than 200μA. These gate devices can be triggered by sense coils, proximity switches and microprocessors.
“Despite the SJ Series’ compact D-PAK and V-PAK footprints, its high junction temperature of 150 C allows for performance comparable to that of SCR thyristors in larger TO-220AB and TO-263 packages because it has a wider operating margin,” said Koichiro Yoshimoto, business development manager, Semiconductor Business Unit, at Littelfuse.
For more information, visit Littlefuse’s website.
Masterbond Two Component Epoxy
(Image courtesy of Masterbond.)
Masterbond has released the EP110F8-5, an epoxy developed for potting, sealing, encapsulation and casting applications. EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system features electrical insulation properties including a volume resistivity exceeding 1015 ohm-cm, a dielectric constant of 2.91 at 1 KHz and a dissipation factor of 0.009 at 1 KHz.
This two component epoxy has a one to two mix ratio by weight with a moderate mixed viscosity of 7,000-11,000 cps and good flow properties. It requires an elevated temperature cure at 250-300°F in 4-6 hours. EP110F8-5 has a pot life of 2-3 days at room temperature.
It is serviceable over the temperature range of -73 C to +149 C. Part A of EP110F8-5 is tan in color and Part B is brown. This system is available for use in ½ pint, pint, quart, gallon and 5 gallon container kits.
For more information, visit Masterbond’s website.
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