EW - Assembly Edition - Amphenol Connectors, Littlefuse Diode Array & More

AC Multilayer PCB Manufacturing

(Image courtesy of Advanced Circuits.)

Advanced Circuits (AC) has introduced a series of multilayer PCB (printed circuit board) designs with the aim of allowing engineers to create more powerful boards while at the same time shrinking the overall size of the PCB. Prepreg is the material used in the multilayer PCB lamination process – a woven glass cloth with epoxy resin.

Capabilities of AC’s multilayer PCB technology include:

Multilayer RF designs up to 8 layers
Oversized boards up to 37″ x 120″
Laser Direct Imaging (LDI)
Laser Drilled Microvias (HDI)

For more information, visit AC’s website.

Amphenol Interconnect Technology for the Wind Industry

(Image courtesy of Amphenol.)

Amphenol has released a series of connectors for use in the wind power industry that are designed for use on land or off-shore applications. They can withstand vibration, salt spray, humidity, dust, EMI/EMC as well as temperature extremes.

The Wind-Lok product line enables quick connection of large gauge copper and aluminum cables. Designed to speed up the installation of wind turbine tower assemblies, Wind-Lok replaces labor intensive, onsite termination of power cables in terminal block enclosures.

In addition, Amphenol Anytek – a division of Amphenol Industrial Products Group – offers six types of terminal blocks, including wire protector, rising clamp, screw pluggable, spring pluggable, spring clamp and barrier. These terminal blocks provide the connection for wire-to-wire and wire-to-PCB and are mainly used in power line connection applications as well as part of the mini-size terminal block used for signal connection applications.

A complete list of Amphenol’s wind power technologies is available on the company’s website.

HARTING SMT Connectors

(Image courtesy of HARTING.)

HARTING has launched angled male versions of its miniaturized har-flex SMT connectors with pre-leading contacts, an option for manufacturers to protect sensitive electronics from damage during operational plugging and unplugging. This variant addresses a particular risk associated with modifying modular electronic systems.

These connectors contain contacts of two different lengths. The pre-leading contacts are 0.3 mm longer in the mating face and ensure that functions like the grounding contact are the first to connect during insertion and the last to disconnect during unplugging. Thanks to flexible contact loading, these connectors also can be configured with lagging contacts that lose electrical contact before the other contacts when the board is being disconnected.

For more information, visit HARTING’s website.

Littlefuse TVS Diode Array

(Image courtesy of Littlefuse.)

Littlefuse has introduced a series of small-footprint TVS Diode Arrays (SPA Diodes) that are optimized for protecting high-speed signal pins. The SP3422-04UTG Series 0.2pF 22kV TVS Diode Array integrates four channels of low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may be exposed to destructive electrostatic discharges (ESD). This component can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard without performance degradation.

“The SP3422-04UTG Series is just one-third the size of a typical four-line array, which permits straight-through routing, eliminating signal integrity issues with fan outs,” said Tim Micun, business development manager at Littelfuse. “Because it combines a small footprint with the lowest loading capacitance available in this format, it’s ideal for use in mobile devices, where board space is at a premium.”

Additional technical specifications can be found on Littlefuse’s website.

Masterbond Electrically Conductive Die Attach Adhesive

(Image courtesy of Masterbond.)

Masterbond has released the EP3HTSDA-1, a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a thermal conductivity of over 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)].

EP3HTSDA-1 is NASA low outgassing approved. Dimensionally stable, it has a Shore D hardness of 75-85 and is engineered to withstand thermal cycling and shock. This epoxy system adheres well to metals, ceramics and silicon dies. Service operating temperature range is from -80°F to +400°F.

This product contains silver fillers and has a volume resistivity of <0.001 ohm-cm. It retains conductivity upon aging and provides moisture and chemical resistance. This compound is formulated for applications in the communication, aerospace, medical, electronic, automotive and defense industries. EP3HTSDA-1 is also available for use in syringe applicators.

Information concerning pricing and availability is located on Masterbond’s website.

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