Electronics Weekly - Maxim Transceivers, TI DLP System & More

Analog Devices Safer Battery Manufacturing

(Image courtesy of Analog Devices.)

Analog Devices has introduced a precision integrated analog front end, controller and pulse-width modulator (PWM) for battery testing and formation capable of increasing system accuracy and efficiency in lithium-ion battery formation and grading. Compared to conventional technology, the AD8452 provides 50 percent more channels in the same amount of space, adding capacity and increasing battery production throughput.

The AD8452 uses switching technology that recycles the energy from the battery while discharging and delivers 10x more accuracy than conventional switching solutions. The higher accuracy allows for more uniform cells within battery packs and contributes to longer living batteries in applications such as electric vehicles. It also enhances the safety of manufacturing processes by providing better detection and monitoring to help prevent over and undercharging, which can lead to battery failures.

Additional technical specifications are available on Analog Devices’ website.

Maxim Transceivers

(Image courtesy of Maxim.)

Maxim has released the MAX22500E/MAX22501E (half-duplex) and MAX22502E (full-duplex) ESD-protected RS-485/RS-422 transceivers, which extend the reach of communication up to 100Mbps over 50m.

The settable pre-emphasis feature within the MAX22500E and MAX22502E enables 2x faster data rates for increased encoder resolution and reduced latency. Pre-emphasis extends cables up to 50 percent longer to communicate over longer distances. A large receiver hysteresis (250mV) provides better capabilities compared to EFT. In addition, by improving the signal integrity and robustness, system designers can achieve the same level of performance with lower-cost cables. The transceivers operate over the -40 C to +125 C temperature range.

For more information, visit Maxim’s website.

Microchip 8-Bit MCU with Core Independent Peripherals

(Image courtesy of Microchip.)

Microchip has launched a line of 8-bit microcontrollers (MCUs) that combine a Controller Area Network (CAN) bus with an array of Core Independent Peripherals (CIPs). The CIPs increase system capabilities while making it easier for designers to create CAN-based applications without the complexity of added software.

The PIC18 K83 devices contain 15 CIPs including: Cyclic Redundancy Check with memory scan for ensuring the integrity of non-volatile memory; Direct Memory Access enabling data transfers between memory and peripherals without CPU involvement; Windowed Watchdog Timer for triggering system resets; 12-bit Analog-to-Digital Converter with Computation (ADC2) for automating analog signal analysis for real-time system response; and Complementary Waveform Generator enabling high-efficiency synchronous switching for motor control.

Information concerning pricing and availability can be found on Microchip’s website.

Microsemi Adaptec Smart Storage Adapter Support

(Image courtesy of Microsemi.)

Microsemi has announced interoperability between its 12 gigabits per second (Gbps) SAS/SATA host bus adapter (HBA), the Adaptec HBA 1100, and Cavium’s ThunderX2 ARM-based CPU. The Adaptec HBA 1100 is optimized for software-defined storage, cold storage and other raw high-performance connectivity applications for data centers, server original equipment manufacturers (OEMs) and server original design manufacturers (ODMs).

It provides adapters in a range of port configurations, from 4 to 24 ports, and utilizes Microsemi's 28 nm storage controller – the SmartIOC 2100 – providing an optimal power profile for target applications. It also offers support for host-managed and host-aware shingled magnetic recording drives as well as broad OS driver support, including inbox driver support.

For more information, visit Microsemi’s website.

TI DLP Technology for Augmented Reality HUDs

(Image courtesy of Texas Instruments.)

Texas Instruments (TI) has unveiled the next evolution of DLP technology for in-vehicle head-up display (HUD) systems. The DLP3030-Q1 chipset, along with supporting evaluation modules, gives automakers and Tier-1 suppliers the ability to bring bright, dynamic augmented reality (AR) displays to windshields and place critical information within the driver's line of sight.

Designers can take advantage of the automotive-qualified DLP3030-Q1 chipset to develop AR HUD systems that project virtual image distances (VIDs) of 7.5 meters and greater. This is made possible by the architecture of DLP technology that allows HUD systems to withstand the intense solar loads created when projecting long VIDs. The combination of increased VIDs and the ability to showcase imagery across a wide field of view lets designers create AR HUD systems with enhanced picture depth for an interactive, non-distractive infotainment and cluster system.

For more information, visit TI’s website.

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