Advantest Automated IC Handler
The M4171 can be used to remotely conduct device handling and thermal control from anywhere around the world through a network connection. In addition to requiring fewer operators and lowering labor costs, this handler maximizes system utilization among working groups in different locations.
Additional technical specifications are available on Advantest’s website.
EMS Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
These dry films are capable of fine line and space definition in complex patterns with resolutions down to 3 µm. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The 5 µm dry film negative photoresist is the most recent addition to EMS’ line of film and liquid negative photoresists formulated for making microfluidic channels on MEMS devices and integrated circuits.
For more information, visit EMS’ website.
EVG Wafer-to-Wafer Direct Hybrid Bonding
The copper/oxide hybrid bonding process, a key enabler for 3D high-density IC applications, was demonstrated in Leti's cleanrooms using EVG's automated GEMINIFB XT fusion wafer bonding system. This result was obtained in the framework of the program IRT Nanoelec headed by Leti. EVG joined the institute's 3D Integration Consortium in February 2016.
Vertical stacking of semiconductor devices has become an increasingly viable approach to enabling continuous improvements in device density and performance, and wafer-to-wafer bonding is an essential process step to enable 3D stacked devices.
For more information, visit EVG’s website.
Nordson Plasma System for Roll-to-Roll Production
The RollVIA system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces and etchback, which removes a slight amount of dielectric contamination between internal copper planes during production of PCBs.
Information concerning pricing and availability can be found on Nordson’s website.
SCREEN OLED Panel Production
Both the SK-E1500G and SK-E1500H feature SCREEN’s Levicoater slit type coating unit. The Levicoater uses a levitated transfer system equipped with twin nozzles to handle the two kinds of photoresist that are essential for OLED manufacturing. The unit allows the systems to keep pace with the reducing thickness of glass support substrates and miniaturization of TFT arrays, ensuring compatibility with a rapidly diversifying range of device production processes.
The SK-E1500H also incorporates transport technologies that enable it to perform simultaneous processing of two 6th generation half-substrates. This ability delivers improvements in production efficiency.
For more information, visit SCREEN’s website.
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