Electronics Weekly – Microchip Debugger, Samsung Chip-Scale LEDs & More

Microchip In-Circuit Debugger

MPLABPICkitTM 4 In-Circuit Debugger. (Image courtesy of Microchip Technology.)

Microchip Technology has introduced the MPLABPICkitTM 4 In-Circuit Debugger. The in-circuit programming and debugging development tool is meant to replace the PICkit 3 programmer by offering faster programming, a wider voltage range (1.2-5V), improved USB connectivity and more debugging interface options. In addition to supporting Microchip’s PIC microcontrollers (MCUs) and dsPIC Digital Signal Controllers (DSCs), the tool also supports debugging and programming for the CEC1702 family of hardware cryptography-enabled devices.

The debugger connects to the user’s computer using a USB 2.0 interface and can be connected to the target via an 8-pin single inline header that supports interfaces such as 4-wire JTAG and serial wire debug with streaming data gateway. It is also backward compatible for demo boards, headers and target systems using 2-wire JTAG and In-Circuit Serial Programming compatibility.

For more information, visit Microchip’s website.

Microsemi Terabit OTN Switching Cards

DIGI-G5. (Image courtesy of Microsemi.)

Microsemi has announced the DIGI-G5, enabling packet optical transport platforms to triple in capacity while reducing power consumption by 50 percent per port. The DIGI-G5 provides 1.2 terabits per second (Tbps) of combined OTN and client interfaces and standardized 25 Gigabit Ethernet (GE), 50GE, 200GE, 400GE, Flexible OTN (FlexO) and Flexible Ethernet (FlexE). In addition, DIGI-G5 includes an integrated security engine which allows encrypted optical connections.

Additional technical specifications are available on Microsemi’s website.

Samsung Chip-Scale LED Series

LM101B, LH181B and LH231B. (Image courtesy of Samsung.)

Samsung has announced its fillet-enhanced chip-scale package (FEC) LED lineup – the LM101B, LH181B and LH231B.The FEC LEDs are based on Samsung’s CSP technology which builds TiO2 (Titanium dioxide) walls around the side surfaces of the chip to direct light output upwards. The technology provides higher light efficacy than conventional CSP LEDs. Moreover, reduced cross-talk between neighboring packages allows each package to be placed in close proximity to one another.

With the FEC’s small form factor and reduced cross-talk, the LM101B is well-suited for spotlighting applications where packages can be densely placed within a small light-emitting surface area. The LM101B is also simpler to mount compared to other mid-power CSP LEDs due to a modified electrode pad.

Information concerning pricing and availability can be found on Samsung’s website.

Synopsys Security Protocol Algorithms

(Image courtesy of Synopsys.)

Synopsys has added the ChaCha20 and Poly1305 (RFC7539) algorithms to its DesignWare Multipurpose Security Protocol Accelerator IP, allowing designers to implement the most recent encryption and authentication functionality to protect their IoT system-on-chips (SoCs).

This update increases security protocol performance by supporting data sequencing as well as parallel processing of cryptographic operations like authentication and encryption/decryption. With the addition of these algorithms to the Security Protocol Accelerator IP, users can secure Internet communication applications that rely on the Transport Layer Security (TLS) protocol version 1.2 and 1.3, including browsers, voice-over-IP devices and smart home applications.

For more information, visit Synopsys’ website.

TI GaN FET Drivers

GaN power portfolio. (Image courtesy of Texas Instruments.)

Texas Instruments (TI) has released two GaN field-effect transistor (FET) drivers for use in applications such as light detection and ranging (LIDAR) and 5G radio-frequency (RF) envelope tracking. The LMG1020 and LMG1210 can deliver switching frequencies of 50 MHz while improving efficiency and providing smaller solution sizes that were not possible with silicon MOSFETs.

The LMG1210 is a 50-MHz half-bridge driver intended for GaN FETs up to 200 V. The device’s adjustable dead time control feature is designed to improve efficiency by as much as 5 percent in high-speed DC/DC converters, motor drives, Class-D audio amplifiers as well as other power-conversion applications.

For more information, visit TI’s website.


Missed last week’s Electronics Weekly? Click here.