AMEC Inductively Coupled Plasma Production
AMEC unveiled the Primo nanova inductively coupled plasma (ICP) etcher for high-volume front-end production of memory and logic integrated circuits (ICs). Key features include a symmetric chamber configuration that enables high-pumping speed, as well as a low-capacitive coupling coil design and a temperature-controlled multiple-zone electrostatic chuck (ESC).
The nanova system was engineered to tackle today’s IC manufacturing hurdles where new materials and transistor structures, double and even quadruple patterning, and other technology advancements are helping to ensure the continued shrinking of devices.
For more information, visit AMEC’s website.
AM Advanced Lithography
Applied Materials (AM) released several papers focused on solving the industry challenges in device scaling, including edge placement error (EPE)—the misalignment of critical features on one layer with features on other layers—mask and wafer defects, line edge roughness and critical dimension variations to help improve device performance and yield.
The papers focus primarily on metrology, inspection and process control for microlithography. In a paper titled “EUV lithography qualification: comparison of alternative wafer inspection methodologies and sensitivities,” defect inspection sensitivity on EUV absorber defects programmed on a test mask was studied using a defect review scanning electron microscope (DRSEM). Defect detection sensitivity was compared between DUV mask inspection and optical wafer inspection with a goal of detecting 10 percent critical dimension (CD) variation defects.
Additional insights from AM’s technical papers can be found on the company’s website.
Hitachi Enhanced Microwave ECR Etching
Hitachi announced the development of the Enhanced Microwave ECR Etching Module, adevice designed for semiconductor device manufacturing processes. The module mounts onto the Conductor Etch System 9000 Series, one of Hitachi’s conductor etch platforms, and supports the development and mass production of semiconductor devices at 7 nm and beyond.
The Conductor Etch System generates a stable plasma in the high-vacuum, low-pressure regime and uses the microwave ECR method capable of performing low-damage etching. The improved module is an etch chamber based on a new structure that improves the exhaust capacity for reaction by products that inhibit etching.
For more information, visit Hitachi’s website.
LPKF PCB Production
LPKF launched several devices related to the prototyping of printed circuit boards (PCBs). The ProtoMat S103 circuit board plotter, for example, can be used to create circuit boards. If required, it performs further processing steps such as drilling holes for through-plating of double-sided circuit boards or multilayer boards. The machine also separates individual PCBs or mills the front panels for housings.
LPKF also has systems for the subsequent assembly of PCBs so that PCB production can be completed on-site. The stencils produced with ProtoMat or ProtoLaser are held in position by the stencil printer ProtoPrint S when printing solder paste. The semi-automatic pick and place system, ProtoPlace S, supports the assembly process. The user is guided through the individual working and setting phases via an LCD display.
Information concerning pricing and availability of these systems can be found on LPKF’s website.
Nordson Solder Paste Jetting System
Nordson has introduced the Liquidyn P-Jet SolderPlus jet valve and solder paste system. This noncontact jetting system is designed specifically to jet Nordson EFD SolderPlus dispensing paste.
The jet dispensing system eliminates the need for Z-axis movement. This allows for faster production speeds when compared to contact dispensing. It also makes it easy to dispense solder paste consistently onto uneven surfaces or parts with varying tolerances. In addition, the modular design of the P-Jet SolderPlus valve simplifies service and maintenance.
For more information, visit Nordson’s website.
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