Electronics Weekly—Synopsys Automotive SoC, TI Microcontrollers & More

Maxim IC Power Modules

Maxim Himalaya uSLIC Power Modules.(Image courtesy of Maxim.)
Maxim has released a family of micro system-level IC (“uSLIC”) power modules. The MAXM17532 and MAXM15462 integrated DC-DC power modules are part of Maxim's portfolio of Himalaya power systems intended for industrial, health-care, communications and consumer markets. With these modules, users get the benefits of industry switching regulators with the size of a low dropout (LDO) linear regulator.

These uSLIC power modules shrink the size of the power supply by 2.25x with a small package size. This is achieved by combining a synchronous wide-input Himalaya buck regulator with built-in FETs, compensation and other functions with an integrated inductor.

For more information, visit Maxim’s website.


Microsemi HBA Processors

Microsemi Adaptec HBA 1100 processors. (Image courtesy of Microsemi.)
Microsemi has announced interoperability between its 12 gigabits per second (Gbps) SAS/SATA host bus adapters (HBAs) and redundant array of independent disk (RAID) adapters, including the Adaptec HBA 1100, SmartHBA 2100 and SmartRAID 3100, and the AMD EPYC processor series.

AMD is part of Microsemi’s Accelerate Ecosystem Partner Program, which facilitates collaboration between companies in the semiconductor integrated circuit, intellectual property, systems, software, tools and design industries to integrate, test and deliver prevalidated designs and system-level products for users in markets such as aerospace and defense, data center and communications.

Additional technical information is available on Microsemi’s website.


RS Components Flush-Mount Pushbuttons

Harmony Flush XB5F series. (Image courtesy of RS Components.)
RS Components has announced the availability of more than 150 new lines of flush-mount pushbuttons from the Schneider Electric Harmony XB5F series. Designed for control panels and targeted toward panel builders, machine builders and maintenance engineers, the plastic range features an improved design.

The series has been designed to meet the particular performance requirements of machines and electrical control panels in harsh environments and is compliant to IEC and UL international standards. Featuring IP ratings of IP66, IP67, IP69 and IP69K, and temperature ranges from –40 to +70°C, the range has also seen improved mechanical endurance and shock resistance characteristics.

Information regarding pricing and availability of the push button series can be found on RS Components’ website.


Synopsys Automotive SoC

The R-Car product lineup. (Image courtesy of Renesas.)
Synopsys has partnered with Renesas to help develop its R-Car V3H system-on-chip (SoC). The R-Car family is the central SoC series of the Renesas autonomy platform, which provides end-to-end automotive systems scaling from secure cloud connectivity and sensing to vehicle control.

The R-Car V3H SoC includes a power-efficient hardware accelerator for convolutional neural networks (CNNs). A high level of performance is needed to detect traffic signs, lanes, pedestrians, vehicles and other obstacles in real time. Front cameras are mounted next to the windshield, where they are exposed to direct sunlight, so low power consumption is crucial to minimize further heat dissipation.

For more information, visit Renesas’ website.


TI Multi-Band MCUs

Texas Instruments SimpleLink MCUs. (Image courtesy of Texas Instruments.)
Texas Instruments (TI) has introduced its SimpleLink wireless and wired microcontrollers (MCUs). These devices offer low power consumption and concurrent multi-standard and multi-band connectivity for Thread, Zigbee, Bluetooth 5 and Sub-1 GHz. With increased memory and connectivity options, the SimpleLink MCU platform offers designers 100 percent code reuse across TI's ARMCortex-M4-based MCUs to enhance and connect sensor networks to the cloud.

The SimpleLink MCU platform is a single development environment that provides hardware, software and tool options for users developing Internet of Things (IoT) applications. The platform includes a single software architecture, modular development kits and free software tools for each point in the design life cycle.

For more information, visit TI’s website.

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