Bruker Spectrometer
Bruker has launched the INVENIO Fourier Transform Infrared (FT-IR) research spectrometer, which combines several VERTEX70 processes, such as FM technology for simultaneous mid and far IR spectroscopy. The MultiTectTM system allows for control of up to five internal detectors, covering the spectral range from far infrared to Vis/UV.
In addition, an integrated touch panel provides configuration setups and workflows for R&D applications, and the system can also be switched to notebook operation. The TransitTM channel allows for the transmission of measurements without removing experiments from the sample compartment.
For more information, visit Bruker’s website.
LPKF Plastic Welding
LPKF has announced the InlineWeld 6200 laser system for plastic welding. This system allows safe, hygienic and hermetically sealed connections to be made between plastic components without chemical additives or particles and with low mechanical component stress. The technology is used for applications such as the joining of plastic housings or geometric bodies, as well as in microfluidics.
The InlineWeld 6200 laser provides weld seam widths in the micrometer range, tight seams and particle-free operation, making it ideal for use in medical technology. Thanks to a refined focus variant, the laser achieves fine seam structures, and can also be equipped for use in clean rooms.
Additional technical specifications are available on LPKF’s website.
Nordson Needle Valve Dispensing Technology
Nordson has introduced the xQR41V series needle valve, which features a 60 percent smaller form factor than standard valves; an exchangeable, modular design for greater customization and process control; and a Quick Release(QR) clasp to replace wetted parts in seconds.
With the valve’s smaller profile of 64mm length x 23.7mm diameter, operators can mount several xQR41V needle valves close together for greater output per batch. Ideal for automated assembly processes, the smaller form factor makes it easier to dispense fluids in tight spaces and at more complex angles. It also produces in a smaller wetted path, resulting in less retained fluid volume, which minimizes fluid waste.
For more information, visit Nordson’s website.
Premier Farnell Sub-GHz Kit
Premier Farnell has launched the element14 development kit for the TI SimpleLink Sub-1 GHz Sensor to Cloud Linux Gateway.The kit provides an end-to-end tool to enable a Sub-1 GHz sensor network with an Internet of Things (IoT) gateway and cloud connectivity.
element14kit contains the components needed to create a full sensor network, including a gateway design based on the BeagleBone Black, the Wireless Connectivity Cape for BeagleBone Black, and the TI SimpleLink dual-band CC1350 wireless MCU LaunchPad development kit acting as the MAC co-processor. The kit also includes an additional CC1350 wireless MCU LaunchPad kit acting as a long-range sensor node.
For more information, visit Farnell’s website.
SCREEN E-Beam Direct Write Lithography Pilot Line
SCREEN has partnered with Taiwan’s National Tsing Hua University (NTHU) to develop massively electron beam direct writing (MEBDW) maskless lithography technology. The MEBDW lithography technology enables “on-chip security,” making Taiwan the world's first development and pilot production for security chips with unique IDs, which provide information security for the Internet, AI, electronic payment and automotive chips.
According to NTHU’s Professor Po-Wen Chiu, “In addition to developing security chips, it can also be used as a maskless IC design verification platform which survives the startup IC design companies by significantly reducing the soaring costs derived from the photo masks, and a low-cost foundry service with high resolution and high graphic flexibility for the niche applications.”
For more information, visit SCREEN’s website.
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