Applied Materials CMP and Device Scaling
Applied Materials recently discussed the role of chemical mechanical planarization (CMP) techniques and technologies pertaining to electronic device scaling at the 2018 SPIE Advanced Lithography conference. According to the company, CMP can facilitate chip designers’ ability to build smaller electronic devices and features.
CMP has been critical for enabling copper dual-damascene integration and, over the last decade, has supported transistor and device inflections. These include the replacement of metal gate where CMP was first used to create the gate, and FinFET transistors where additional CMP steps for the top gate and gate cap enable the transition from 2D to 3D architecture.
For more information about Applied Materials’ work involving CMP, visit the company’s website.
Bruker NMR Spectroscopy
Bruker announced the AVANCE NEO NanoBayfor NMR spectroscopy. The device includes dual-channel transmit and receive capabilities to routine 300 and 400 MHz NMR, and is suited for analysis in academic, pharmaceutical and industrial research markets, as well as helping generate new discoveries in structural and cell biology.
With the NEO “transceiver” architecture, each NMR channel in the AVANCE NEO is a functional spectrometer, thereby enabling a range of multi-receive experiments. The small footprint NanoBay supports various applications including chemistry research and analysis, high-throughput screening for applied markets and quality control, and structure verification in drug discovery operations.
Additional technical information is available on Bruker’s website.
CM Industry 4.0 MES
Critical Manufacturing (CM) released Version 6 of its Critical Manufacturing MES (Manufacturing Execution Systems) software. V6 introduces an equipment integration module, Connect IoT, which is designed to simplify the integration of all devices, equipment and the Internet of Things (IoT). V6 Connect IoT reduces the time and cost needed for companies to benefit from smart technologies and Industry 4.0 manufacturing models.
V6 also extends the graphical user interface to provide configure-to-task, platform-agnostic mobility to all operator, supervisor and maintenance transactions,and an enhanced scheduling module.Connect IoT also has a drag-and-drop logic interface, with no need for coding. The system automatically abstracts workflows from specific drivers. Users can implement re-usable, extensible workflow elements with complex logic.
For more information, visit CM’s website.
EVG Augmented Reality Manufacturing
EVG and WaveOptics collaborated to develop augmented reality (AR) waveguides intended for industrial manufacturing and medical applications. Waveguides are the core optical component for wearable AR.
“A combination of EVG’s expertise, together with our scalable and versatile technology, will allow AR end-user products to be on the market for under $600 by the end of next year,” stated David Hayes, WaveOptics CEO. “This collaboration is key to unlocking the development of AR wearables; together we are well positioned to bring mass market innovation in AR, opening new paths to scalability at a lower cost than ever before.”
Additional information concerning the development of AR can be found on WaveOptics’ website.
LPKF Laser Depaneling of PCBs
LPKF introduced the MicroLine 2000 Ci laser system for printed circuit board (PCB) depaneling. Due to the continuing trend toward miniaturization and greater packing densities in the PCB sector, laser technology has become the standard for depaneling in recent years.
The MicroLine series’ laser source reduces the pure cutting time by up to 50 percent and supports the high cycle times of SMT lines. The laser separates and cuts unassembled as well as single or double-sided SMD-assembled printed circuit boards. In addition, the MicroLine series of lasers ensure clean, burr-free cuts in FR4, FR5, CEM materials, ceramics, polyimides, RF materials and other printed circuit board substrates.
For more information, visit LPKF’s website.
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