ASM DEK Printing and Placement Platform
ASM Assembly Systems recently showcased its E by DEK printer and E by SIPLACE placement machine. E by DEK is engineered for manufacturers in the low/medium-volume, high-mix sector. With an 11-second core cycle time and features such as HawkEye paste verification, Grid-Lok automatic board support and squeegee pressure feedback controlled by Instinctiv software, E by DEK allows for precise and cost-effective printing of today’s miniaturized, high-density assemblies.
On the other hand, E by SIPLACE features 100 percent digital vision inspection, SIPLACE Pro software, placement head flexibility with adaptive pick-up, Smartfeeder E feeder technology and linear motors. The combination of these capabilities lets manufacturers in the mid-speed sector accommodate the realities of increasing product variation, NPI demands, build-to-order requirements and shorter planning cycles.
For more information, visit ASM’s website.
Bruker Benchtop WDXRF System for Elemental Analysis
Bruker launched the S6 JAGUAR, a benchtop Wavelength Dispersive X-Ray Fluorescence (WDXRF) spectrometer. The S6 JAGUAR extends the company’s range of XRF instruments by closing the gap between floor standing WDXRF and benchtop EDXRF instruments.
The S6 JAGUAR provides increased sensitivity and a 50 percent reduction in measurement times due to its WDXRF goniometer, closely coupled X-ray optics and 400 watt excitation power. Based on the solid-state HighSense XETM detector, with linear range of 2 million counts per second, the S6 JAGUAR provides accuracy and precision for quality control in industrial labs for minerals, mining, chemistry, petro-chemistry and cement.
Additional technical specifications are available on Bruker’s website.
Heraeus Metal Ceramic Substrate
Heraeus Electronics introduced its metal ceramic substrate Condura.prime (AMB-Si3N4) and the associated substrate family. Condura.prime is an active metal brazed silicon nitride substrate (Si3N4) that offers various benefits compared to other metal ceramic substrates.
Its inherent mechanical properties ensure high bending strength and high fracture toughness. Furthermore, Condura.prime provides increased thermal conductivity for heat dissipation and is ideal for high-performance power electronic module productionfound in the automotive, energy and traction industries.
For more information, visit Heraeus Electronics’ website.
Nordson Dispensing System
Nordson released the Meter Series XYZ Robot Dispensing System, intended for potting or bead applications, with either one- or two-component materials. The Meter Series XYZ system allows users to improve cycle and batch times with reduced production and material costs. The device features a higher payload and gantry-mounted meter for hose-free valve mounting, enabling greater shot accuracy with wide and difficult ratio materials. It comes equipped with a simple-to-use teach pendant for quick setup and programming.
Information concerning pricing and availability can be found on Nordson’s website.
SCREEN Direct Imaging System for Circuit Patterning
SCREEN finalized development of its LANZAN direct imaging system for PCB patterning, designed for the mass production of circuit patterns using next-generation mSAP technology. LANZAN is equipped with a wide-angle, precision exposure engine and is able to perform rapid, single pass imaging of high-definition circuit patterns at a minimum line width of 8 um.
Non-stop image capture is also possible thanks to the high positioning accuracy (±7 um) achieved by LANZAN’s alignment technology. The system also features a range of other functions that support imaging quality, including auto-focus and mechanical clamp systems.
For more information, visit SCREEN’s website.
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