Advantech IIoT Co-Creation Model
Advantech announced the co-creation of IoT (Internet of Things) Solution Ready Packages (SRPs) with several domestic and international corporations. Thirty sets of SRPs will be released this year. Advantech will hold the 6,000-participant IoT Co-Creation Summit and AIoT.SRP press conference Nov. 1 and 2 in Suzhou, China.
According to Dr. Allan Yang, Advantech’s chief technology officer, IIoT (Industrial Internet of Things) systems must be able to integrate the collection of industrial equipment data based on a variety of standards with edge device management, wireless communication and data analysis. Such solutions must also integrate the creation of visually intuitive reports on cloud platforms, as well as the creation of AI models and their integration with expert knowledge.
For more information, visit Advantech’s website.
Master Bond Epoxy with Low Coefficient of Thermal Expansion
Master Bond launched its EP30LTE-2 epoxy, developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small- to medium-sized castings where a low coefficient of thermal expansion (CTE) is required.
EP30LTE-2 is a dimensionally stable epoxy system with low linear and volumetric shrinkage upon curing. The compressive strength of the cured material is 24,000-26,000 psi and its CTE is low at 10-13 x 10-6/in/in/°C. It is a reliable electrical insulator featuring volume resistivity of more than 1015 ohm-cm.
Information concerning pricing and availability can be found on Master Bond’s website.
SCHUNK Robot Arm Gripping System
SCHUNK released its gripping system kit, which is compatible with all Universal Robots (UR) robot arms. The kit includes a range of standardized components for the six-axis lightweight UR robots, which comprises both fields of application, gripping and changing, measuring forces and torques.
Specially coordinated interfaces and adapters ensure that all modules of the modular system are combinable with the UR robot arms and can be quickly exchanged. Instead of planning and implementing the electric or pneumatic actuation and sensor connections individually each time, and at great expense, the interfaces of the grippers, quick-change modules and sensors are adjusted to one another within the modular system.
For more information, visit SCHUNK’s website.
SHENMAO Water-Soluble Solder Paste
SHENMAO introduced its PF606-PW215 water-soluble solder paste. PF606-PW215 features continuous high-speed printability that produces increased solder paste print quality as well as a wide reflow process window for improved solderability. Additionally, the paste has a long shelf and stencil life as well as wetting and clean ability.
Other features include: anti-slump properties that remain six to 12 hours after print time, a tack force that remains at greater than 130gf after a 24-hour stand, paste activity that remains after a 19-hour stand and no flux residue after cleaning.
For more information, visit SHENMAO’s website.
Virtual Industries Vacuum Pen Holder Kit
Virtual Industries developed a line of hand tools that replace tweezers or other gripping means for many applications. The PEN-VAC Kit with 8 Probes + Cups and Vacuum Pen Holder is a completely self-contained unit—there are no batteries or hoses to get in the way.
The PEN-VAC Kit is supplied with five bent probes mounted with ESD-SAFE Static Dissipative Buna-N Cups from 3.18mm, 4.76mm, 6.35mm, 9.53mm and 12.7mm diameter, and three straight probes mounted with ESD-Safe Static Dissipative Buna-N Cups sized 6.35mm, 9.53mm and 12.7mm in diameter. Also included with the kit is a VBM-3 Vacuum Pen Holder with eight locations for holding the probes and cups.
For more information, visit Virtual Industries’ website.
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