Electronics Weekly—Production Edition: Advantest PCIe Development, Nordson Solder Nozzle Tinning System and More

Advantest PCIe Production

MPT3000. (Image courtesy of Advantest.)

Advantest has introduced a test system for developing, debugging and mass producing PCIe Gen 4 solid-state drives (SSDs) on the company’s MPT3000 platform. The system can now cover all test insertions for PCIe Gen 4 devices—from engineering with the MPT3000ES to reliability demonstration testing with the MPT3000ENV and production testing with the MPT3000HVM—without waiting for third-party PCIe Gen 4 SSD applications to be commercially available.

For more information, visit Advantest’s website.

Heraeus Die Top System

Die Top System. (Image courtesy of Heraeus Electronics.)

Heraeus Electronics has unveiled a device for chip-top contacting in power electronics modules. The Die Top System boosts the chip’s current-carrying capacity by more than 50 percent and provides greater reliability, which allows manufacturers of electric and hybrid cars to probe the limits of power transmission in simulations.

Due to its design, the Die Top System not only increases the power module’s current carrying capability, it also boosts its power cycling capability. This makes it possible to have junction temperatures of up to 200 °C. A conductive copper foil is applied to the semiconductor chip using a sinter paste.

Additional technical specifications are available on Heraeus’s website.

Hitachi Schottky Field Emission Scanning Electron Microscope

SU7000 Schottky FE-SEM. (Image courtesy of Hitachi.)

Hitachi has announced the SU7000, a Schottky field emission scanning electron microscope (FE-SEM) that incorporates a large specimen chamber and high throughput with simultaneous acquisition as well as analysis of various signal types.

The SU7000 provides improved signal separation of secondary electrons and back-scattered electrons through technologies, including a detector specifically designed to enhance precision as well as increase efficiency. Additionally, the SU7000 is equipped with a large specimen chamber and 18 accessory ports.

For more information, visit Hitachi’s website.

Nordson Automatic Solder Nozzle Tinning

SELECT Automatic solder nozzle tinning system. (Image courtesy of Nordson.)

Nordson has launched its automatic solder nozzle tinning system, which is available for all SELECT selective soldering machines and compatible with lead-free and tin-lead solder alloys. Nordson’s automatic solder nozzle tinning system eliminates spraying altogether and uses a flux core solder wire to clean and re-tin the solder nozzle in a single operation.

The advantage of the automatic solder nozzle tinning system is that it removes oxides and residues from the solder nozzle, improving solder flow to ensure consistent soldering quality. Because the tinning system does not produce overspray or contamination of the printed circuit board assembly or selective soldering machine, it is useful for clean production shop floor environments where caustic materials are not permitted.

For more information, visit Nordson’s website.

SCREEN Digital Front End Integration

EQUIOS universal workflow. (Image courtesy of SCREEN.)

SCREEN and Electronics For Imaging (EFI) have partnered to establish bidirectional connectivity between SCREEN’s EQUIOS universal workflow and EFI’s Fiery digital front ends. The centralized workflow provides increased efficiency and labor savings through automation for today’s printing industry.

The EQUIOS universal workflow combines its prepress workflow and the inkjet technology supported by many print service providers. Featuring various print workflow automations and user interfaces, EQUIOS can control the entire print manufacturing process from workflow rule design, layout editing and production progress monitoring to quality management.

For more information, visit SCREEN’s website.

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