Electronics Weekly – FujitsuGallium-Nitride Transistors, Pasternack Vertical Launch Connectors & More

Fujitsu Gallium-Nitride Transistors

Gallium-nitride transistors. (Image courtesy of Fujitsu.)

Fujitsu has developed a crystal structure that both increases current and voltage in gallium-nitride (GaN) high electron mobility transistors (HEMT), effectively tripling the output power of transmitters in the microwave band.

The GaN HEMT technology can serve as a power amplifier for equipment such as weather radar. By applying the developed technology to this area, it is expected that the observation range of the radar will be expanded by 2.3 times, enabling early detection of cumulonimbus clouds that can develop into torrential rainstorms.

For more information, visit Fujitsu’s website.

Maxim LED Backlight Driver

MAX20069 LED backlight driver. (Image courtesy of Maxim.)

Maxim released the MAX20069, which integrates four I2C-controlled, 150mA LED backlight drivers and a four-output thin-film-transistor liquid-crystal display (TFT-LCD) bias into one chip.

MAX20069 supports larger screen sizes and higher resolution by providing positive analog supply voltage (PAVVD) and negative analog supply voltage (NAVDD). Both are required for low-temperature polysilicon panels (LTPS) that provide increased resolution and lower cost than the amorphous silicon panels currently in use.

For more information, visit Maxim’s website.

Pasternack Solderless Vertical Launch Connectors

Vertical launch connectors. (Image courtesy of Pasternack.)

Pasternack introduced a line of solderless vertical launch connectors that are suited for networking, high-speed computing and telecommunications applications. The line consists of 12 models that provide VSWR as low as 1.3:1 and a maximum operating frequency of up to 50 GHz, depending on the model. These launches include a reusable clamp attachment and can be used for microstrip or stripline.

They are offered in male and female versions, covering 2.4mm, 2.92mm and SMA interfaces. All models provide solderless installation. These removable vertical launches feature a stainless-steel outer conductor, gold-plated beryllium copper center contact and Polyetherimide (PEI) insulators.

For more information, visit Pasternack’s website.

RS Components PCB Stacking Connectors

BergStak Lite PCB stacking connectors. (Image courtesy of RS Components.)

RS Components launched the BergStak Lite 0.8mm vertical mating PCB-to-PCB connector system. The BergStak Lite is suited to high-density parallel board stacking applications in IP phones, measurement equipment, point-of-sale terminals, portable industrial terminals and test equipment.

The BergStak Lite system includes straight PCB headers and sockets with a choice of 40, 60, 80 or 100 contact positions arranged at 0.8mm pitch in one to four rows. A choice of 16 PCB stacking heights is also available in 1mm increments from 5mm to 20mm.

For more information, visit RS Components’ website.

Samsung 5G Modem

Exynos Modem 5100. (Image courtesy of Samsung.)

Samsung unveiled its Exynos Modem 5100, a 5G modem that is compatible with 3rd Generation Partnership Project (3GPP) Release 15, the standard specification for 5G New Radio (5G-NR). Built on 10nm process technology, the modem also supports legacy radio access technologies designed into one chip.

The modem provides a maximum downlink speed of up to 2Gbps in 5G’s sub-6 GHz settings and 6Gbps in mmWave settings, which are about 1.7 and five times the data transfer speeds of its predecessor, respectively. Fast and stable data communication can also be secured in 4G networks with a downlink speed of 1.6Gbps.

For more information, visit Samsung’s website.

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