AM Wafer-level Packaging
Applied Materials (AM) released a report about the impacts of wafer-level packaging (WLP). According to the company, “In today’s mobile-centric world, form factor and functionality rule. A major challenge for designers is keeping their products thin and lightweight as more and more chips are added inside.” In response to this, AM is seeing increased use of WLP for chips used in mobile products. WLP refers to the technologies of packaging an array of integrated circuitry together at the wafer level rather than assembling them into individual packaged units.
AM’s Nokota Electrochemical Deposition (ECD) system ensures a wafer remains completely sealed throughout the plating sequence to protect it from potential damage. The system’s single-chamber design also allows for quick, in-fab reconfigurations between different process flows, making it ideal for handling the growing selection of WLP schemes, product mixes and capacity demands.
For more information, visit AM’s website.
Hitachi Screening Equipment for Phthalates
Hitachi has developed the HM1000A thermal desorption mass spectrometer to enhance screening accuracy for four types of phthalates (Restricted Substances) for the amended Restriction of Hazardous Substances (RoHS) directive. The use of four chemicals will be restricted in the European Union starting in July 2019.
Phthalates are widely used as plasticizers for softening plastic and rubber in vinyl chloride products such as wire sheaths, electrical insulation tape and packing films. The recent amendment of the RoHS directive has created the need for manufacturers to assess and manage the amounts of phthalates contained in parts and finished products, either as part of procurement or on the factory floor.
For more information, visit Hitachi’s website.
Manncorp Dry Boxes
Manncorp released a family of ULTRA DRY MSD dry cabinets and baking dry cabinets. Dry boxes—also known as dry cabinets or desiccant dry cabinets—provide humidity-controlled storage for all types of moisture sensitive components, boards and assemblies.
IPC J-STD-0338.1 and JEDEC standards for handling and storing moisture sensitive devices (MSDs) recommend a relative humidity (RH) of <5 percent or less. Manncorp’s dry cabinets (V series) and baking dry cabinets (H series) are both designed to provide ongoing, maintenance-free storage that meets or exceeds these specifications. The H-series baking dry cabinets add the additional ability to restore pre-reflow MSDs that have been exposed to humidity greater above 5 percent RH.
For more information, visit Manncorp’s website.
Nordson Large-volume Dispenser
Nordson introduced its Helios SD-960 Series Automated Fluid Dispensing System. The Helios dispenser deposits single (1K) and two-component (2K) materials, such as abrasive thermal interface materials (TIM), silicones, epoxies and greases. Applications include electronic and PCB assembly that requires potting, sealing, gasketing and structural adhesives/staking.
Volumetric 2K metering with servo control provides a controlled mix ratio that ensures correct fluid characteristics. Being able to dispense thermal interface materials reduces the use of pre-cut thermal pads, makes changes in the production process easier and more flexible, and reduces costs.
For more information, visit Nordson’s website.
SCREEN 8-Page CtP Systems
SCREEN has completed development of its PlateRite 8600NII series of eight-page thermal CtP systems. These systems are equipped with high-output fiber laser diode exposure heads, providing increased productivity of up to 32 plates per hour.
All models feature functionality improvements that produce energy savings of around 60 percent during operation and 73 percent during standby, as well as a power-saving mode that reduces energy consumption during idling.
For more information, visit SCREEN’s website.
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