Emerson Location Awareness System
Emerson unveiled its Location Awareness System, part of its Plantweb digital ecosystem that works to enhance industrial safety by protecting employees at refineries, chemical plants, and oil and gas platforms. The platform works by using the secure industrial wireless infrastructure.
The system combines a software suite with gateways, access points, location anchors and personnel tags certified for hazardous conditions. The software includes a safety-mustering feature that shows which employees have or have not checked in to their muster points during an emergency, man-down alerts that allow personnel in dangerous situations to initiate an alert for emergency response teams, and a geofencing feature that designates perimeters around areas and sends an alert if and when that perimeter is crossed.
For more information, visit Emerson’s website.
FARO Laser Tracker Platform
FARO announced its 6DoF Vantage series of laser trackers. The laser trackers are capable of measuring or scanning over tens of meters with no loss in accuracy, line of sight issues and simultaneous measurement by many operators.
The 6DoF Vantage line includes two models, the VantageE6, with an operating range of 35m, and the VantageS6, with an operating range of 80m. Both are tested to International Electrotechnical Commission (IEC) standards for shock, vibration and extreme thermal conditions, and are IP52 rated for dust and water resistance.
For more information, visit FARO’s website.
Metron3D 3D Scanner
Metron3D launched the Metron E, a structured-light 3D scanner. The Metron E 3D scanner is pre-calibrated for accuracy. It is simple to setup and use.It generates high resolution and accurate scans in about 1 second per scan. The E-HD model creates an average of 4.9 million data points per scan with an accuracy of up to 25 micrometers (0.025mm).
In addition, Metron E usesFlexScan3D scanning software that makes the 3D-scanning experience more user-friendly and efficient, from capturing 3D data to post-processing. Much of the 3D-scanning workflow is streamlined and automated.
For more information, visit Metron3D’s website.
Synopsys Support for 3D-IC Packaging Technologies
Synopsys stated that its Design Platform now supports TSMC’s wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS) packaging technologies. The design platform, combined with the 3D-IC reference flow, allows user deployments for multi-die technology in mobile computing, network communication and automotive electronics applications.
The platform-wide system includes multi-die and interposer layout capture, physical floorplanning and implementation, as well as parasitic extraction and timing analysis coupled with physical verification.
For more information, visit Synopsys’ website.
TI Reinforced Isolated Amplifier
Texas Instruments (TI) unveiled a reinforced isolated amplifier that features increased precision, working voltages and lifetime reliability. With upgrades that include better nonlinearity and higher temperature stability, the ISO224 allows engineers to overcome previous performance limitations inprecision systems.
The ISO224 also allows for more accurate measurements of ±10-V signals, which are often used in industrial applications, with 25 percent better nonlinearity, eight times lower gain error, lower offset drift and faster system response time.
For more information, visit TI’s website.
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