Anda PCB Loader
Anda Technologies has announced a series of board handling conveyors suited for a range of PCB handling applications. The LD-460W Magazine Automatic Loader can optimize work-in-progress (WIP) material flow during assembly, coating, dispensing and other processes.
The LD-460W also features selectable pitch settings of 10, 20, 30 and 40mm; an air pressure supply of 5 kgf/cm (70 psi); and automatic full magazine loading and empty magazine offload.
For more information, visit Anda’s website.
EVS Solder Recovery System
EVS International has introduced its 500LF Solder Recovery System, which can recover up to 80 percent of pure solder with a higher ROI from the waste dross. The 500LF has the same footprint as a printer and is aimed at multiple industries.
The device can be utilized with one lead wave and one lead-free wave, with nitrogen or selective solder pots that remove only small amounts of dross every hour, or with multiple waves where one EVS 500LF is connected to each wave.
For more information, visit EVS’ website.
Littelfuse Protection Module
Littelfuse has launched a series of TVS Diode Arrays (SPA Diodes) designed to protect two lines of 10/100/1000Base-T Ethernet ports from damage sustained during overcurrent and overvoltage events. Through-package routing permits the SP4031 Series Hybrid Protection Module’s circuitry to protect an Ethernet PHY chip from damage due to electrostatic discharge (ESD) and lightning-induced surge.
During a prolonged overvoltage event such as a power failure, this component will present a high impedance. The high impedance state will reset once the power failure event has ended. During a fast transient event, the component will clamp, thereby protecting any downstream chipset from surge or ESD damage.
For more information, visit Littelfuse’s website.
Master Bond Epoxy with Thermal Shock Resistance
Master Bond has released EP110F8-3, a two-part epoxy system suited for sealing, encapsulating, potting and casting applications. EP110F8-3 features improved thermal cycling and shock resistance, passing 10 cycles from -55°C to +125°C with no signs of cracking.
It also has an electrical insulation profile with a low dielectric constant of 2.67 as well as a low dissipation factor of 0.006, both measured at 75°F for 1KHz. The epoxy has a mix ratio of one to two by weight; the color of Part A is clear, while the color of Part B is amber. In addition, it has a low mixed viscosity of 1,000-2,000cps.
For more information, visit Master Bond’s website.
Metcal Connection Validation Soldering System
Metcal has unveiled its CV-500 Connection Validation Soldering System. The intermetallic compound thickness is important in the formation of a solder joint, and Connection Validation (CV) is a technology that evaluates the quality of the solder joint by calculating the intermetallic compound formation and providing closed loop feedback to the user.
The CV-500 system also features a 2.8-inch color touchscreen with HD graphics, an integrated net power meter with optional tip temperature display that is ideal for SMD touch-up and small component rework.
For more information, visit Metcal’s website.
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