EW – Production Edition – AM Cobalt Power Scaling, Heraeus Gold Conductor Paste and More

Advantest 5G Semiconductor Connectivity

MPT3000 PCIe Gen 4. (Image courtesy of Advantest.)

Advantest will demonstrate a range of IC testing and wafer metrology at SEMICON Korea on January 23-25. Among them are upgrades to the MPT3000 platform, an integrated test system for developing, debugging and mass producing PCIe Gen 4 solid-state drives (SSD), as well as the T5851 memory tester for next-generation mobile protocol NAND including UFS3.x and PCIe Gen4 BGA.

For more information, visit Advantest’s website.

AM Cobalt Power and Performance Scaling at Single-Digit Logic Nodes

Logic CMOS scaling goals. (Image courtesy of Applied Materials.)

Applied Materials (AM) has released information concerning the use of cobalt to boost power and performance. According to AM, “Chip designers require simultaneous improvements in ‘PPAC’: power, performance and area/cost. Achieving these improvements is becoming increasingly difficult as classic Moore's Law scaling slows.”

“Cobalt promises lower resistance at smaller geometries, in part due to the metal’s inherent characteristics when compared to tungsten and copper at small dimensions, and in part because cobalt works with thinner barriers, which allow for sufficient volume to be maintained.”

For more information, visit AM’s website.

Bruker Oxygen, Nitrogen and Hydrogen Analysis by Inert Gas Fusion

G6 LEONARDO. (Image courtesy of Bruker.)

Bruker has launched its G6 LEONARDOTM, a gas fusion (IGF) analyzer for oxygen, nitrogen, and hydrogen (ONH) concentration measurements in inorganic samples. The G6 LEONARDO introduces SampleCare into IGF-analysis for metals and ceramics.

The G6 LEONARDO comes with ready-to-use pre-calibrated methods for industrial standard applications like ON or H in steel and titanium, O in copper, and OH in magnetic materials and titanium alloys. This makes the device suited for process and quality control in primary metal manufacturing, ceramics and additive manufacturing.

For more information, visit Bruker’s website.

Heraeus Electronics Gold Conductor Paste

Thick film gold conductor paste. (Image courtesy of Heraeus Electronics.)

Heraeus Electronics has introduced a thick film gold conductor paste aimed for applications such as medical devices as well as high-frequency circuits for communication. The paste performs well on dielectrics and on oxide substrate compositions even when multiple firing steps are required.

Furthermore, the thick film paste can screen print and resolve fine features down to 100 micron-size lines and spaces. The paste also has the ability to be etched using methods like photolithography processes.

For more information, visit Heraeus’ website.

Nordson Hot Bar Reflow Soldering and Automated Flux Dispensing

C-TurnFlux. (Image courtesy of Nordson.)

Nordson has unveiled its C-TurnFlux system, the automated stand-alone hot bar system that combines flux dispensing with hot bar reflow soldering. The C-TurnFlux hot bar reflow system is used to solder a range of assemblies, such as an LCD with flex attached to a PCB, multiple wires to a PCB board, or connectors and other components. It enables soldering for processes that require two soldering connections per product or simultaneous soldering of two small products.

For more information, visit Nordson’s website.

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