AIM to Demonstrate REL22 Alloy at SMTA Dallas Expo
AIM Solder will demonstrate its REL22 alloy later this month at the 2019 SMTA Dallas Expo and Tech Forum. REL22 is an alloy developed to address reliability and production quality issues common to similar multi-element alloys. Both internal and user testing has indicated that REL22 improves product survival in intense thermal exposure operating environments such as under-hood automotive, avionics/aerospace and LED lighting.
For more information, visit AIM Solder’s website.
AMETEK Copper Core Connect
AMETEK has launched CopperCore Connect, a cost-effective alternative to thick solder preforms (usually made of expensive materials) that is often used in high-performance electronic packaging.
The product’s thermal and electrical conductivity can be up to seven times greater than existing alternatives, allowing for improved thermal management. Its design grants users the ability to create final, high-powered wire/ribbon connections to contact spots that otherwise cannot be reached or must be made earlier in the assembly process.
For more information, visit AMETEK’s website.
Littelfuse SiC Schottky Diodes
Littelfuse has introduced two second-generation series of 650V, AEC-Q101-qualified silicon carbide (SiC) Schottky Diodes. The LSIC2SD065CxxA and LSIC2SD065AxxA Series SiC Schottky Diodes are available with a choice of current ratings (6A, 8A, 10A, 16A or 20A).
The diodes provide power electronics system designers with a variety of performance features, including negligible reverse recovery current, high surge capability, and a maximum operating junction temperature of 175°C, making them well suited for applications that require thermal management.
For more information, visit Littelfuse’s website.
LPKF Laser Structuring of FR 4 and HF Materials
LPKF has released its ProtoLaser ST, an instrument designed for use in laboratories that delivers fast and precise processing of both standard FR4 PCBs and PCBs made of sensitive RF materials. Using a specialized laser and optimally programmed software, the machine provides material processing for PCB prototyping in a process that does not require the use of etching technology.
For more information, visit LPKF’s website.
Master Bond Thermally Conductive, Flame Retardant Encapsulant
Master Bond has unveiled EP93AOFR, a two-part epoxy that can be used in encapsulation and potting applications, as well as in bonding, sealing and coating. According to Rohit Ramnath, senior product engineer at Master Bond, “This flame retardant non-halogenated system is not only thermally conductive, 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)], but it is also a reliable electrical insulator with a volume resistivity greater than 1014 ohm-cm. EP93AOFR has an easy to use 1:1 mix ratio by weight and a good flow profile with a mixed viscosity of 30,000-150,000 cps.”
For more information, visit Master Bond’s website.
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