Electronics Weekly – Renesas Power Modules, TI Isolated Gate Drivers and More

Maxim USB-C Buck Charger

MAX77860 buck charger. (Image courtesy of Maxim.)

Maxim launched its MAX77860 USB-C buck charger. The MAX77860 provides a USB-C port controller and charger to eliminate the need for a separate host controller, simplifies software development and reduces overall costs for applications such as power banks, industrial computers, scanners and radios.

The MAX77860 also integrates USB-C configuration channel (CC) port detection and a battery charger for 15W applications. These functions make battery charging at a fast rate possible under the USB-C specification and contribute to 30 percent smaller design size.

For more information, visit Maxim’s website.

Microchip Unified Software for SAM Microcontrollers

MPLAB Harmony software. (Image courtesy of Microchip.)

Microchip released version 3.0 of its MPLAB Harmony software. Version 3.0 of the unified software environment is progressively adding support across the company’s portfolio of 32-bit PIC and SAM MCUs, giving developers more options to meet different end application requirements. This version also adds enhancements to streamline designs, such as royalty-free security software through a partnership with wolfSSL, as well as modular software downloads that allow designers to only download select portions of software based on the needs of an application.

For more information, visit Microchip’s website.

Renesas Power Modules

PMBus power modules. (Image courtesy of Renesas Electronics.)

Renesas Electronics announced a pair of encapsulated hybrid digital DC/DC PMBus power modules—the 10-amp ISL8280M and 15-amp ISL8282M. These power modules provide power density of 115mA/mm2 in a 12mm x 11mm package, with up to 95 percent peak efficiency. They are complete single-channel, synchronous step-down regulated power supplies that operate over an input voltage range of 5V to 16V.

For more information, visit Renesas’ website.

Samsung DRAM for Memory Applications

DDR4 DRAM. (Image courtesy of Samsung.)

Samsung has developed a third-generation 10-nanometer-class (1z-nm) 8Gb Double Data Rate 4 (DDR4) DRAM for memory applications. The creation of DDR4 DRAM without the use of extreme ultraviolet (EUV) processing has pushed the limits of DRAM scaling further than before.

Mass production of the 1z-nm 8Gb DDR4 will begin within the second half of this year to accommodate next-generation enterprise servers and PCs expected to be launched in 2020.

For more information, visit Samsung’s website.

TI Isolated Gate Drivers

IGBT & SiC gate drivers. (Image courtesy of Texas Instruments.)

Texas Instruments (TI) introduced several isolated gate drivers that feature increased levels of monitoring and protection for high-voltage systems. The UCC21710-Q1, UCC21732-Q1 and UCC21750 allow users to create smaller, more efficient designs in traction inverters, onboard chargers, solar inverters and motor drives.

The devices also offer sensing features for insulated-gate bipolar transistors (IGBTs) and silicon carbide (SiC) metal-oxide semiconductor field-effect transistors (MOSFETs) to create greater system reliability in applications operating up to 1.5 KVRMS. With integrated components, the devices provide fast detection time to protect against over current events while ensuring safe system shutdown.

For more information, visit TI’s website.

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