Amphenol Power Connectors
Amphenol has introduced its MagnaMate ATHP line of thermoplastic power connectors featuring RADSOK contact technology. Designed for various “xEV” applications, the MagnaMateline is IP67 rated and available in single- or two-pole housings with rated current from 20A to 180A. MagnaMate also includes optional integrated HVIL safety features and Electromagnetic Interference(EMI) shielding protection, which can withstand temperatures ranging from -40°C to +130°C.
For more information, visit Amphenol’s website.
Littelfuse Battery Mount
Littelfuse has launched its Sealed M10 Battery Mount ZCASE Fuse, which is designed for commercial vehicle product lines. The M10can mount directly to an ISO standard battery to provide short circuit protection to the high current circuits that power electric vehicles.
Its placement on the battery eliminates the need for any unfused, high-current wires off of the battery—even the battery terminal itself is protected from short circuits and accidental contact. In the event of an electrical fault, the ZCASE fuse performs rapidly, eliminating the false blows that can occur in legacy high-speed fuse designs.
For more information, visit Littelfuse’s website.
LPKF Microfluids Through Glass
LPKF has developed a processing method called Laser Induced Deep Etching (LIDE) that allows for the high-precision generation of defect-free microstructures in thin glass for use in microfluidics. Due to its properties, glass is an ideal material for use in microfluidics.
According to Robin Krüger, head of Development Innovation at LPKF, “LIDE realizes clean drill holes, cuts and other structures in standard thin glass extremely precise, quick and for high quantities. This makes glass processed with LIDE ideal for microfluidics, for example, in flow-through microarrays or for the functional integration of complex microfluidic applications.”
For more information, visit LPKF’s website.
Master Bond Curing Epoxy
Master Bond has unveiled its UV22DC80-1Med epoxy, a single component, nanosilica-filled compound featuring a UV- and heat-curing mechanism. The epoxy passes USP Class VI tests for biocompatibility and also meets ISO 10993-5 for cytotoxicity, making it well suited for use in medical devices.
For more information, visit Master Bond’s website.
SCHUNK Gripping System
SCHUNK has released its Co-act EGP-C gripper, which has standardized attachment fingers that can be equipped with universally usable and interchangeable inserts in various geometries.
The Co-act EGP-C gripper is available as a completely preassembled unit with the corresponding interface for the KUKA LBR iiwa, UR and FANUC CR robots. Due to an operating voltage of 24V DC, the device is also suitable for mobile use. The entire regulation and power electronics are fitted in the interior of the gripper, meaning they don't take up any space in the control cabinet.
For more information, visit SCHUNK’s website.
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