Like most product lifecycle management (PLM) software, Siemens Teamcenter enables businesses to manage product-related data and activities from concept through retirement. Its single source of truth allows teams to collaborate and make informed decisions. Well-known for its scalability and flexibility, Teamcenter can be tailored to the individual demands of each organization.
Teamcenter is one PLM portfolio, no matter the deployment model chosen: on-premises, infrastructure-as-a-service (IaaS) or software-as-a-service (SaaS). Teamcenter X is the cloud-based software as a service (SaaS) offering.
Teamcenter version 14.0 (January 2022) PLM included personalized dashboards, a new Requirements Manager workspace and an extension of the Product Carbon Footprint Calculator to cover all available manufacturing steps and the inclusion of overhead rates.
Siemens followed this with Teamcenter 14.1 (June 2022), enhancing its PLM capabilities and focusing on their Active Workspace user interface designed to be more intuitive. Teamcenter 14.2 and Active Workspace 6.2 became available in November 2022.
Siemens intends for Teamcenter to be used by everyone in the product development process to access data anywhere and on any device. Active Workspace is an “inventive” web-based client for Teamcenter, allowing the user to get information quickly. Active Workspace is a key part of Siemens’ High-Definition PLM (HD-PLM) vision.
So, what is new with Teamcenter 14.2?
New—Teamcenter X Solution for the Semiconductor Industry
Companies are looking for a more robust supply chain. Those in the semiconductor industry want to not just withstand but also capitalize on disruption.
According to the SIA, the global semiconductor market is predictably inconsistent. As the demand for chips rises, semiconductor companies will need to invest in more research, design and manufacturing. The question is not whether more chip manufacturing facilities, or fabs, will be built, but rather where they will be built.
“Semiconductor demand will grow over the long term, as chips continue to make the world smarter, more efficient and better connected,” according to semiconductors.org.
The new Teamcenter X solution, Semiconductor Lifecycle Management, uses Siemens’ industry knowledge and cloud PLM technologies to help semiconductor companies solve the obstacles impeding digitalization.
The Siemens’ press release and website describe the update as “a unified data model,” “trusted traceability” and “new product introduction acceleration.” This can be summarized as Semiconductor Lifecycle Management and reduces the time to market (TTM) and prevents costly redesigns by connecting engineering throughout the manufacturing process. it’s therefore a win for those in that industry segment.
Integrated Interface Management
Product interfaces are the rules specifying how a product works with users or other systems. These interfaces can be hardware or software, or the interfaces between humans and computers. Product interfaces are crucial in ensuring that products are usable (and efficient) by their target audience. Well-designed product interfaces need to consider the consumers’ needs and the underlying systems’ technical requirements.
The process of managing the interactions and relationships between the various components, systems or organizations is known as interface management. By introducing integrated interface management, users can capture and manage interfaces like any other content in Teamcenter. Now, users will understand the implications of changing product interfaces.
Deliver Greener Products at Competitive Costs
Teamcenter V14 introduced a “cradle-to-gate” carbon footprint calculation. With this, users can find the product carbon footprint, including direct and indirect production emissions. V14.1 added carbon taxation, meaning you can see the effect of the carbon footprint on net sales. V14 also added integration with ClimateTech, supplying the most up-to-date CO2 emissions data.
With V14.2, users can link a 3D model to the calculation. From the 3D model, they can extract manufacturing-dependent parameters that affect production costs. This allows them to quickly estimate cost and carbon footprint at any point in the production process.
High-Performance BOM Visualization (Digital Mock-Up)
A picture is worth a thousand words, especially when it comes to your products.
V14.1 introduced lightning-fast BOM tree and graphics in Active Workspace. This is now even faster with V14.2 from improved client-side rendering and new options to select which parts load and render. Users can work with large assemblies efficiently by loading only the parts they need at a given time.
V14.2 also adds new exploded views that allow users to explore assemblies and the inter-part relationships using the new exploded view.
Simulate and Verify Early Concept Designs
Developed by Siemens, the Hierarchical Evolutionary Engineering Design System (HEEDS) platform automates design exploration and optimizes complex engineering problems. Its algorithms and built-in expertise investigate the design space, evaluate design alternatives and present optimal solutions.
Now, with Teamcenter V14.2, users can drive content to HEEDS and then perform multi-objective optimization for multiple criteria simultaneously. This can produce thousands of designs so that the best overall solution can be determined. However, it preserves traceability to the source parameters and criteria. The end result? Finding trade-offs and uncertainties in your designs early in the design process.
Search Across Applications
eamcenter V14.2 introduces one-stop shop searching so that users can find what they need when they need it from any source. This includes searching across the properties stored in the CAD data.
Teamcenter V14.2
Teamcenter is a leading choice in PLM. Forrester Research gave Teamcenter the highest possible score in the market presence category, as well as the highest possible score for strategy.
All that Teamcenter 14.2 has to offer can be installed on premises or as a cloud service with Teamcenter X.