ANSYS president and CEO, Jim Cashman is very excited with the new release: “Global enterprises have already embraced ANSYS as the engineering simulation standard for proven physics, high performance computing solutions and a unified modeling environment … ANSYS 16.0 builds on that 45-year legacy by delivering even more game-changing functionality.”

Improved UI for Electronic Device Simulations

As for the Electronics Desktop, it is a single window that brings an integrated interface to assess circuits, electromagnetics, and systems analysis into a single workflow. The goal is to increase user productivity and ensure best practices.

Another interesting feature in ANYSIS 16.0 is ability to create and integrate complete 3D electronic components. This will simplify the modeling of electronic devises. In fact, a library of simulation ready components exits and can be applied without changing boundary conditions or material properties.

“You need four main elements to successfully integrate an electronic device to the IoT: antenna, power, embedded code, and simulating the device’s structure and environment” said ANSYS’ chief product officer, Walid Abu-Habda. “A lot of money and research went into ANSYS’ antenna, power consumption embedded code, and multiphysics simulations to solve these significant problems.”

Simplifying Computational Fluid Dynamics and Simulation Optimizations

Therefore, reducing the preprocessing time for CFD simulations is a key improvement to ANSYS 16.0. In fact, ANSYS reports that for some complex CFD models, the preprocessing has been completed 40% faster than in previous releases.

CFD simulations have also been sped up thanks to ANSYS 16.0’s improved high performance computing (HPC) capacity. The HPC improvement allows a simulation to be computed over thousands of CPU cores.

Another upgrade that will assist complex simulations is the ability of the adjoint solver to model up to 50 million cells. The adjoint solver can simplify the optimization of a design by automating the shape optimizations using user defined constraints. By implementing larger models into the solver, more complex designs will be optimized.

Structural Materials Simulations with easier use of thin metals, composites and elastomers

The latest release of ANSYS has simplified the modeling of thin materials as well as their connections into assemblies.

Composites are traditionally difficult to model as their properties are not homogenous and are often dependent on the manufacturing. However, ANSYS 16.0 has included new functionalities and a tool to model composites and understand the results.

Structural engineers might also enjoy the fact that ANSYS 16.0 has updated the adaptive meshing technique to better study elastomers. Elastomers are typically used in dampers and seals. The adaptive meshing however, will account for these distortions without re-meshing the system manually.

Finally, the latest structural improvements to ANSYS 16.0 sees improved contact simulations and solver performance. This improved contact simulations has many applications including medical stents. A stent is a mesh inserted into an artery to increase blood flow.

Mathieu Sanchez, co-founder and R&D director, IRRAs Technology, said “The contact improvements released with ANSYS 16.0 will be very useful to further refine the modeling of stent deployment in cerebral aneurysms … The combination of better contact management and the new visualization and customization tools available in ANSYS 16.0 should help us to bring engineering simulation benefits to the surgeons.”

Improved Integration of ANSYS and Model-Based Systems Design

ANSYS 16.0 allows systems engineers to define systems and sub-systems within a model. By improving the definitions of the model, more complex systems can be designed. With the inclusion of MBSD in ANSYS, engineers will be able to improve collaboration in projects.

Source ANSYS.